Dual sputter sources plasma sputtering coater with rotary sample stage HS-PSP180G-2TA-RS

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This type of small plasma sputtering coater adopts two-stage sputtering method, which is widely used for SEM sample preparation or metal coating experiment. Using low-temperature plasma sputtering process, there is no high temperature during the coating process, and it is not easy to produce thermal damage. This small plasma sputtering coater uses PLC control system, all touch screen operation, easy to learn and use. This small plasma sputtering instrument uses a PLC control system, all touch screen operation, easy to learn and use. The equipment is small in size and beautiful in appearance, making it the best choice for laboratory coating experiments.

Technical parameters of dual-head plasma sputtering coating machine:

Sample stage	Size Distance from sample stage to target surface	100mm 20~35mm height adjustable
Plasma sputtering source	Quantity Cooling method	2 inchesx2 Natural cooling
Vacuum chamber	Chamber size Observation window Chamber material Open method Upper and lower cover material Pumping port Intake port	φ180mm x 210mm Omnidirectional visibility High purity quartz Top cover removable 304 stainless steel KF16 1/4 inch ferrule connector
Power configuration	Quantity Output power Sputtering power Max. sputtering current	DC power supplyx1 Max. 150W 1200V 50mA
Vacuum system	Vacuum pump type Pumping port Exhaust interface Pumping rate Ultimate vacuum Vacuum measurement	Dual-stage rotary vane vacuum pump KF16 KF16 1.1L/s(4m3/h) ≥0.1Pa Resistance vacuum gauge
Others	Power supply Total power Dimension Weight	AC 220V 50Hz 1.5kW 500mm x 320mm x470mm 30kg

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